Tezzaron® Semiconductor Corporation is a leader in 3D wafer stacking and TSV (Through Silicon Via) processes. We have successfully demonstrated the world's first wafer-stacked 3D-ICs, including stacked microprocessors, sensors, and SRAM devices. With our DiRAM4 prototype complete, we are now focused...See more
Headquarters:
United States of America
Company Type:
SME
Company size:
1-10 Employees
Year Founded:
1999 (26 years)
Address:
7600 CHEVY CHASE DR; BLDG 2, SUITE 300; AUSTIN, TEXAS 78752, US
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