We specialize in designing and manufacturing cutting-edge semiconductor inspection systems for various stages of wafer processing, including post wirebond inspection, post dicing inspection, post probing inspection, wafer sorting, wafer packing, wafer batch transfer, wafer thickness and roughness me...See more
Headquarters:
Malaysia
Company Type:
SME
Company size:
51-200 Employees
Address:
NO. 2, JALAN JURURANCANG U1/21, HICOM GLENMARIE INDUSTRIAL PARK; SHAH ALAM, SELANGOR 40150, MY
HIGH
spending power
