Advanced equipment manufacturer and subcontracting service provider specializing in Wafer Level Packaging (WLP) and Electroless Under Bump Metallization (UBM) for the semiconductor industry. With over 25 years of experience and facilities in Germany, California, and Malaysia, we offer comprehensive ...See more
Headquarters:
Germany
Company Type:
MNC / Large Enterprise
Company size:
201-500 Employees
Address:
AM SCHLANGENHORST; NAUEN, BRANDENBURG 14641, DE
At a glanceHIGH
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