Pac Tech, a member of the Nagase group, is a global leader in providing cutting-edge wafer bumping, packaging, and solder ball placement solutions. We offer top-notch contract services for low-cost wafer-level bumping and packaging, ensuring high quality at competitive prices.
Headquarters:
Malaysia
Company Type:
SME
Company size:
11-50 Employees
Address:
null
At a glanceLOW
spending power
