Heyan Technology specializing in diamond dicing saw, wafer grinders, and related peripheral equipment. Heyan relies on nearly 40 years experience on R&D and the manufacturer of : - Precision dicing saw (wafer saw, package saw, jig saw machines, wafer ring cut machine, wafer edge trimming machine, ...See more
Headquarters:
China
Company Type:
MNC / Large Enterprise
Company size:
201-500 Employees
Year Founded:
2011 (14 years)
Address:
null
At a glanceHIGH
spending power
