A leading semiconductor packaging service company offering innovative wafer-level CSP solutions for various applications such as CMOS imaging sensors, RFID, MEMS devices, and LEDs. Our cutting-edge technologies enable miniaturized, reliable, and cost-effective packaging, significantly enhancing the ...See more
Headquarters:
China
Company Type:
MNC / Large Enterprise
Company size:
201-500 Employees
Address:
null
HIGH
spending power
