VIKING TECHNOLOGY PTE. LTD.

Viking Technology, a product division of Sanmina Corporation, is a global technology leader in the field of DRAM memory & Flash storage solutions ranging from high-performance computing SSDs to small form factor flash DRAM modules optimized for industrial, telecommunications, military/defense, and enterprise markets. Viking Technology broadens its technology leadership with several advanced technologies such as memory packaging, multi-chip packaging, system-in-package, and storage class memory. Viking’s comprehensive memory product offerings include Enterprise Class & Industrial Grade SSDs available across a wide portfolio of standard and OEM customized form-factors (2.5”, 1.8” SlimSATA, mSATA, M.2, PCIe/NVMe SSDs, SATADIMM™, Discrete Flash Cards and eUSB). Viking Technology also supports the broadest range of DDR4, DDR3, DDR2, DDR and custom modules; from High-Density to Small-Form Factor with Error Checking and Correction (ECC Memory). Viking Technology also specializes in DRAM and Flash Multi-chip packaging, allowing for higher density packages optimized for the military and aerospace environments. Viking Technology’s Parallel family of Packaged products are multi-chip package (MCP) solutions that are bare die and wafer level stacked, capable of reducing the overall footprint of memory modules into a single chip. These MCP solutions are military tested, defense avionics ready with future generations optimized for radiation tolerant and space compliant.

Viking Technology, a product division of Sanmina Corporation, is a global technology leader in the field of DRAM memory & Flash storage solutions ranging from high-performance computing SSDs to small form factor flash DRAM modules optimized for industrial, telecommunications, military/defense, and enterprise markets. Viking Technology broadens its technology leadership with several advanced technologies such as memory packaging, multi-chip packaging, system-in-package, and storage class memory. Viking’s comprehensive memory product offerings include Enterprise Class & Industrial Grade SSDs available across a wide portfolio of standard and OEM customized form-factors (2.5”, 1.8” SlimSATA, mSATA, M.2, PCIe/NVMe SSDs, SATADIMM™, Discrete Flash Cards and eUSB). Viking Technology also supports the broadest range of DDR4, DDR3, DDR2, DDR and custom modules; from High-Density to Small-Form Factor with Error Checking and Correction (ECC Memory). Viking Technology also specializes in DRAM and Flash Multi-chip packaging, allowing for higher density packages optimized for the military and aerospace environments. Viking Technology’s Parallel family of Packaged products are multi-chip package (MCP) solutions that are bare die and wafer level stacked, capable of reducing the overall footprint of memory modules into a single chip. These MCP solutions are military tested, defense avionics ready with future generations optimized for radiation tolerant and space compliant.