TECNISCO ADVANCED MATERIALS PTE. LTD.

Last Updated: 14 Nov 2025

TECNISCO ADVANCED MATERIALS PTE. LTD. is ACRA -registered entity that has been operating for 16 years 6 months in Singapore since its incorporation in 2009.

Officially, TECNISCO ADVANCED MATERIALS PTE. LTD. is registered as Private Limited Company with its address 70 TUAS SOUTH STREET 5, Singapore 637806.

Country of registration	Singapore
Registration number	200911856K
Local SIC	32909: Other manufacturing industries n.e.c.
Incorporation date	1 Jul 2009
Company age	16 years 6 months
Official entity type	Private Limited Company
No. of officers	17

Contact

Address:

70 TUAS SOUTH STREET 5, Singapore 637806

Phone number:

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Associated business (2)

TECNISCO ADVANCED MATERIALS PTE LTD
Singapore
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Manufacturing
TECNISCO, LTD.
Japan
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thermal management
structured glass wafers for mems packaging
spacer glass
laser
glass micro fulidic for drug discovery and chemical reaction
diamond
heatsink
mems
customized heatsinks for laser diode and led
Semiconductor
Electronics
TECNISCO is a processing service provider specializing in precision component manufacturing, leveraging DISCO Corporation's cutting and grinding technologies since 1970. Our 'Cross-edge' technology integrates five leading-edge fields - Cutting, Grinding, Polishing, Metalizing, and Bonding - to offer customized solutions for structured glass wafers in MEMS packaging, glass microfluidics for drug discovery and chemical reactions, and tailored heatsinks for laser diodes and LEDs. We collaborate with clients to design and manufacture innovative products through our comprehensive technology suite.

This is the legal entity page of TECNISCO ADVANCED MATERIALS PTE. LTD.. To access company info, company size, news, key maker's emails, visit the profile pages above.

Financials

Fiscal/Budgeting Period	October - December
Auditor	A GARANZIA LLP
Revenue	1m - 5m
Financial period end date	31 Dec 2021
Share Capital - Ordinary shares	SGD 4,000,000

Last updated: 14 Nov 2025

* This information is provided to the best of our research ability and we make no warranties for any inaccuracies or omissions.

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