F&K DELVOTEC BONDTECHNIK SINGAPORE PTE. LTD.

Last Updated: 14 Nov 2025

F&K DELVOTEC BONDTECHNIK SINGAPORE PTE. LTD. is ACRA -registered entity that has been operating for 18 years in Singapore since its incorporation in 2007.

Officially, F&K DELVOTEC BONDTECHNIK SINGAPORE PTE. LTD. is registered as Private Limited Company with its address 20 SCIENCE PARK ROAD, #03-17, TELETECH PARK, Singapore 117674.

Country of registration	Singapore
Registration number	200723403Z
Local SIC	28273: Manufacture and repair of semiconductor assembly and testing equipment (including computer burn-in system)
Incorporation date	19 Dec 2007
Company age	18 years
Official entity type	Private Limited Company
No. of officers	10

Contact

Address:

20 SCIENCE PARK ROAD, #03-17, TELETECH PARK, Singapore 117674

Phone number:

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Associated business (1)

F & K DELVOTEC BONDTECHNIK GMBH
Germany
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bpc
dünndrahtbonder
wirebonder
prozessautomatisierung
mechatronics
microelectronics
semiconductor
laserbonden
wedge-wedge
ultraschallbonden
maschinenbau
ball-wedge
mikroelektronik
thin wire bonder
ball-wedge bonder
bond academy
process automation
heavy wire bonder
dickdrahtbonder
laserbonder
Manufacturing
F & K DELVOTEC Bondtechnik GmbH is a leading manufacturer of wire-bonders, supplying the largest range of wire-bonders from manual to automatic equipment. F & K DELVOTEC Bondtechnik GmbH is globally operating, medium-sized technology leader for wire bond systems. As a preferred equipment partner of the world’s most successful high-end companies in the expansive semiconductor and microelectronics market, we react flexibly to customer requirements and realize tailor-made automation solutions. Microelectronics, mechatronics and process automation form the basis of our technology.

This is the legal entity page of F&K DELVOTEC BONDTECHNIK SINGAPORE PTE. LTD.. To access company info, company size, news, key maker's emails, visit the profile pages above.

Financials

Fiscal/Budgeting Period	October - December
Auditor	CYPRESS SINGAPORE PAC
Revenue	11m - 25m
Financial period end date	31 Dec 2021
Share Capital - Ordinary shares	SGD 69,552

Last updated: 14 Nov 2025

* This information is provided to the best of our research ability and we make no warranties for any inaccuracies or omissions.

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